GlobalFoundries Inks $2B Deal with TSMC to Build Silicon Interposers in New York

GlobalFoundries and TSMC have entered into a five-year, $2 billion agreement to produce silicon interposers for TSMC's CoWoS advanced packaging technology in the US. Manufacturing will expand at GlobalFoundries' Malta, New York facility, with volume production scheduled to ramp up in the first half of 2028. The custom silicon interposers provide high-density connections between logic chiplets and high-bandwidth memory (HBM) stacks for AI and high-performance computing applications. GlobalFoundries will operate as a subcontractor handling multiple customer-specific interposer designs rather than standardized components. The agreement does not cover the final assembly operations, such as bonding logic and HBM to the interposers or attaching them to organic substrates. "By providing manufacturing service using GF's trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain." — Ed Kaste