SK Hynix Eyes Intel Foundry for Next-Gen HBM4E Base Dies in Bid to Break TSMC Monopoly

SK Hynix is reportedly evaluating Intel Foundry's EMIB technology to produce the base die for its HBM4E memory stacks, seeking a direct alternative to TSMC. Early assessments suggest Intel's packaging architecture could reduce costs by approximately 50% in specific use cases compared to TSMC's CoWoS process. The HBM4 logic base dies are highly expensive, costing 3-4 times more to manufacture than the core DRAM components they manage. While the partnership remains unconfirmed, SK Hynix has been testing the EMIB integration since early 2026 and is simultaneously investing over $4B in a new Indiana packaging facility. Samsung is actively developing its own 4nm foundry process specifically designed for HBM4 base dies as competitive pressure mounts.