Intel Hits 1 Million High-NA EUV Wafers, Outpacing Entire Industry Combined

Intel has processed over one million 300-mm wafers using High-NA EUV scanners, a massive jump from just 30,000 wafers in February 2025. The company's production volume now exceeds the cumulative High-NA output of the rest of the semiconductor industry combined. Intel is actively pushing to replace industry-standard 6-inch photomasks with giant 6x12-inch masks to eliminate the need for exposure field stitching. Current field stitching requirements drop scanner throughput from 175 wafers per hour to 125 wafers per hour on the EXE:5200B system. The transition to 6x12 masks would require a complete overhaul of the existing projection lithography supply chain, granting Intel a massive first-mover advantage over its foundry rivals.